Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369250 | Circuit board structure and manufacturing method thereof | Ping-Tsung Lin, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko | 2025-07-22 |
| 12266616 | Integrated circuit package structure | Kai-Ming Yang, John Hon-Shing Lau | 2025-04-01 |