Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414243 | Manufacturing method of package structure | Kai-Ming Yang, Chen-Hao Lin, John Hon-Shing Lau, Yu-Hua Chen, Tzyy-Jang Tseng | 2025-09-09 |
| 12369250 | Circuit board structure and manufacturing method thereof | Ping-Tsung Lin, Kai-Ming Yang, Chia-Yu Peng, Pu-Ju Lin | 2025-07-22 |
| 12309943 | Circuit carrier and manufacturing method thereof and package structure | John Hon-Shing Lau, Ra-Min Tain, Tzyy-Jang Tseng, Chun-Hsien Chien | 2025-05-20 |
| 12250776 | Substrate structure and cutting method thereof | Jeng-Ting Li, Chi-Hai Kuo, Pu-Ju Lin | 2025-03-11 |
| 12243838 | Circuit substrate structure and manufacturing method thereof | Tzyy-Jang Tseng, Pu-Ju Lin, John Hon-Shing Lau | 2025-03-04 |