Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234145 | Methods for wafer bonding | Chien-Wei Chang, Ren-Dou Lee, Yi-Chih Chang, Yi-Hsun Chiu, Yuan-Hsin Chi | 2025-02-25 |
YS
Ya-Jen Sheuh
Overall (2025): #166,139 of 469,880Top 40%
1
Patents 2025