Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234145 | Methods for wafer bonding | Ya-Jen Sheuh, Ren-Dou Lee, Yi-Chih Chang, Yi-Hsun Chiu, Yuan-Hsin Chi | 2025-02-25 |
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Chien-Wei Chang
Overall (2025): #430,147 of 469,880Top 95%
1
Patents 2025