Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234145 | Methods for wafer bonding | Chien-Wei Chang, Ya-Jen Sheuh, Yi-Chih Chang, Yi-Hsun Chiu, Yuan-Hsin Chi | 2025-02-25 |
RL
Ren-Dou Lee
Overall (2025): #243,113 of 469,880Top 55%
1
Patents 2025