Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
WW

Wen-Hsin Wei

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Hsinchu, CA: #135 of 221 inventorsTop 65%
Overall (2025): #176,205 of 469,880Top 40%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12294002 Integrated circuit package and method of forming same Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more 2025-05-06