Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426380 | Integrated circuit having angled conductive feature | Tung-Heng Hsieh, Ting-Wei Chiang, Chung-Te Lin, Hui-Zhong Zhuang, Li-Chun Tien | 2025-09-23 |
| 12402384 | Standard cell design with dummy padding | Chun-Yen Lin, Yen-Hung Lin, Yuan-Te Hou, Tung-Heng Hsieh | 2025-08-26 |
| 12376338 | Semiconductor device structure with dielectric dummy gate and method for forming the same | Tung-Heng Hsieh | 2025-07-29 |
| 12211787 | Interconnect structures and methods of fabrication thereof | Chao-Hsun Wang, Wang-Jung Hsueh, Fu-Kai Yang, Mei-Yun Wang, Shih-Hsien Huang | 2025-01-28 |
| 12199034 | Via rail structure | Hao Kuang, Tung-Heng Hsieh, Bao-Ru Young, Wang-Jung Hsueh, Pang-Chi Wu | 2025-01-14 |