Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363947 | Structure and formation method of semiconductor device with contact structures | Shih-Chieh Wu, Pang-Chi Wu, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang +2 more | 2025-07-15 |
| 12211787 | Interconnect structures and methods of fabrication thereof | Chao-Hsun Wang, Fu-Kai Yang, Mei-Yun Wang, Sheng-Hsiung Wang, Shih-Hsien Huang | 2025-01-28 |
| 12199034 | Via rail structure | Hao Kuang, Tung-Heng Hsieh, Sheng-Hsiung Wang, Bao-Ru Young, Pang-Chi Wu | 2025-01-14 |