Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354959 | Redistribution layer features | Wen-Chun Wang, Tzy-Kuang Lee, Ching-Hung Kao, Yen-Yu Chen | 2025-07-08 |
| 12322742 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2025-06-03 |
| 12253558 | Circuit test structure and method of using | Ching-Fang Chen, Hsiang-Tai Lu | 2025-03-18 |