Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374638 | Passivation structure for metal pattern | Ching-Hung Kao, Kuei-Yu Deng | 2025-07-29 |
| 12354959 | Redistribution layer features | Wen-Chun Wang, Chih-Hsien Lin, Ching-Hung Kao, Yen-Yu Chen | 2025-07-08 |
| 12266684 | High density capacitor | Pei-Jen Wang, Ching-Hung Kao, Meng-Chang Ho, Kun-Mao Wu | 2025-04-01 |
| 12255131 | Capacitor between two passivation layers with different etching rates | Chia-Ming Huang, Ming-Da Cheng, Songbor Lee, Jung-You Chen, Ching-Hua Kuan | 2025-03-18 |