Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278222 | Method of fabricating semiconductor package including sub-interposer substrates | Chulwoo Kim, Hyo-Chang Ryu, Yun-Seok Choi | 2025-04-15 |
| 12272628 | Semiconductor package having interposer substrate | Seungbin Baek, Hyunjung Song, Sangmin Yong | 2025-04-08 |
| 12237241 | Semiconductor package | Seungbin Baek, Hyunjung Song, Jisun YANG | 2025-02-25 |