Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272628 | Semiconductor package having interposer substrate | Yanggyoo Jung, Hyunjung Song, Sangmin Yong | 2025-04-08 |
| 12237241 | Semiconductor package | Yanggyoo Jung, Hyunjung Song, Jisun YANG | 2025-02-25 |