Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278222 | Method of fabricating semiconductor package including sub-interposer substrates | Yanggyoo Jung, Chulwoo Kim, Yun-Seok Choi | 2025-04-15 |
HR
Hyo-Chang Ryu
Overall (2025): #362,287 of 469,880Top 80%
1
Patents 2025