Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431474 | Semiconductor package | Ju-Il Choi, Un-Byoung Kang, Minseung Yoon, Yonghoe Cho, Jeonggi Jin | 2025-09-30 |
| 12424561 | Semiconductor package including interposer | Seung-Kwan Ryu | 2025-09-23 |
| 12412821 | Semiconductor package | — | 2025-09-09 |
| 12278222 | Method of fabricating semiconductor package including sub-interposer substrates | Yanggyoo Jung, Chulwoo Kim, Hyo-Chang Ryu | 2025-04-15 |