Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315780 | Technologies for processor loading mechanisms | Ralph V. Miele, Phil Geng, Mengqi Liu, David Shia, Eric W. Buddrius +1 more | 2025-05-27 |
| 12309933 | Magnetically secured semiconductor chip package loading assembly | Phil Geng, Timothy Glen Hanna, Xiaoning Ye, Jacob McMillian, Ralph V. Miele +2 more | 2025-05-20 |
| 12309966 | Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force | Jin Yang, Jimmy Chuang, Mengqi Liu, Phil Geng, Ralph V. Miele +1 more | 2025-05-20 |