Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12383982 | Laminated device wafer forming method | Zhiwen Chen, Shunsuke Teranishi, Akihito Kawai | 2025-08-12 |
| 12322655 | Method of manufacturing layered device chip assembly | Shunsuke Teranishi, Zhiwen Chen, Akihito Kawai | 2025-06-03 |