Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424456 | Method of manufacturing package device | — | 2025-09-23 |
| 12383982 | Laminated device wafer forming method | Zhiwen Chen, Kyosuke Kobinata, Akihito Kawai | 2025-08-12 |
| 12354995 | Laminated device chip manufacturing method | — | 2025-07-08 |
| 12322655 | Method of manufacturing layered device chip assembly | Zhiwen Chen, Kyosuke Kobinata, Akihito Kawai | 2025-06-03 |
| 12304109 | Method of separating wafer | — | 2025-05-20 |
| 12300545 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Byeongdeck Jang, Akihito Kawai | 2025-05-13 |
| 12198990 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Byeongdeck Jang, Akihito Kawai | 2025-01-14 |