Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12383982 | Laminated device wafer forming method | Kyosuke Kobinata, Shunsuke Teranishi, Akihito Kawai | 2025-08-12 |
| 12322655 | Method of manufacturing layered device chip assembly | Shunsuke Teranishi, Kyosuke Kobinata, Akihito Kawai | 2025-06-03 |
| 12317653 | Method of manufacturing LED display panel | Youngsuk Kim | 2025-05-27 |