Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12383982 | Laminated device wafer forming method | Zhiwen Chen, Kyosuke Kobinata, Shunsuke Teranishi | 2025-08-12 |
| 12322655 | Method of manufacturing layered device chip assembly | Shunsuke Teranishi, Zhiwen Chen, Kyosuke Kobinata | 2025-06-03 |
| 12300545 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi | 2025-05-13 |
| 12198990 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi | 2025-01-14 |