Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300545 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2025-05-13 |
| 12198990 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2025-01-14 |