Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12401010 | 3D processor having stacked integrated circuit die | Steven Teig, Kenneth Duong, Javier A. Delacruz | 2025-08-26 |
| 12381119 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao | 2025-08-05 |
| 12353340 | Systems for high-speed computing using an optical interchange | Horia Alexandru Toma, Zuowei Shen, William Frank Edwards, Gurushankar Rajamani, Hong Liu | 2025-07-08 |
| 12322667 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao | 2025-06-03 |
| 12293993 | 3D chip sharing data bus | Javier A. Delacruz, Steven Teig | 2025-05-06 |
| 12278215 | Integrated voltage regulator and passive components | Javier A. Delacruz, Don Draper, Belgacem Haba | 2025-04-15 |
| 12270970 | Direct-bonded lamination for improved image clarity in optical devices | Belgacem Haba, Rajesh Katkar | 2025-04-08 |
| 12218059 | Stacked IC structure with orthogonal interconnect layers | Steven Teig, Javier A. Delacruz | 2025-02-04 |
| RE50272 | Remote optical engine for virtual reality or augmented reality headsets | Belgacem Haba, Rajesh Katkar | 2025-01-14 |
| 12191267 | Nanowire bonding interconnect for fine-pitch microelectronics | Belgacem Haba | 2025-01-07 |