Issued Patents 2025
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431424 | Buried power rails integrated with decoupling capacitance | Bernd Waidhas, Harald Gossner, Wolfgang Molzer, Michael Langenbuch, Martin Ostermayr +3 more | 2025-09-30 |
| 12406925 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Thomas Wagner, Andreas Wolter, Bernd Waidhas | 2025-09-02 |
| 12394726 | Method to implement wafer-level chip-scale packages with grounded conformal shield | Gianni SIGNORINI, Bernd Waidhas | 2025-08-19 |
| 12382712 | Semiconductor dies and devices with frontside and backside coils for inductive coupling | Peter Baumgartner, Joachim Assenmacher, Walther Lutz, Martin Ostermayr | 2025-08-05 |
| 12374625 | Microelectronic assemblies having topside power delivery structures | Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser | 2025-07-29 |
| 12347796 | Semiconductor dies and devices with a coil for inductive coupling | Martin Ostermayr, Walther Lutz, Joachim Assenmacher | 2025-07-01 |
| 12341096 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Thomas Wagner, Andreas Wolter, Bernd Waidhas | 2025-06-24 |
| 12249553 | Thermal contacts at periphery of integrated circuit packages | Sonja Koller, Vishnu Prasad | 2025-03-11 |
| 12243828 | Microelectronic assemblies having topside power delivery structures | Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser | 2025-03-04 |
| 12243856 | Fan out packaging pop mechanical attach method | David O'Sullivan, Richard Patten, Bernd Waidhas | 2025-03-04 |
| 12211796 | Microelectronic assemblies having topside power delivery structures | Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser | 2025-01-28 |
| 12191571 | Antenna with graded dielectirc and method of making the same | Saravana Maruthamuthu, Bernd Waidhas, Andreas Augustin | 2025-01-07 |