| 12431424 |
Buried power rails integrated with decoupling capacitance |
Harald Gossner, Wolfgang Molzer, Georg Seidemann, Michael Langenbuch, Martin Ostermayr +3 more |
2025-09-30 |
| 12406925 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Thomas Wagner, Andreas Wolter |
2025-09-02 |
| 12394726 |
Method to implement wafer-level chip-scale packages with grounded conformal shield |
Gianni SIGNORINI, Georg Seidemann |
2025-08-19 |
| 12374625 |
Microelectronic assemblies having topside power delivery structures |
Carlton Hanna, Stephen L. Morein, Lizabeth Keser, Georg Seidemann |
2025-07-29 |
| 12362251 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2025-07-15 |
| 12341096 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Thomas Wagner, Andreas Wolter |
2025-06-24 |
| 12243828 |
Microelectronic assemblies having topside power delivery structures |
Carlton Hanna, Stephen L. Morein, Lizabeth Keser, Georg Seidemann |
2025-03-04 |
| 12243856 |
Fan out packaging pop mechanical attach method |
David O'Sullivan, Georg Seidemann, Richard Patten |
2025-03-04 |
| 12211796 |
Microelectronic assemblies having topside power delivery structures |
Carlton Hanna, Stephen L. Morein, Lizabeth Keser, Georg Seidemann |
2025-01-28 |
| 12191571 |
Antenna with graded dielectirc and method of making the same |
Saravana Maruthamuthu, Andreas Augustin, Georg Seidemann |
2025-01-07 |