| 12431424 |
Buried power rails integrated with decoupling capacitance |
Bernd Waidhas, Harald Gossner, Wolfgang Molzer, Michael Langenbuch, Martin Ostermayr +3 more |
2025-09-30 |
| 12406925 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Thomas Wagner, Andreas Wolter, Bernd Waidhas |
2025-09-02 |
| 12394726 |
Method to implement wafer-level chip-scale packages with grounded conformal shield |
Gianni SIGNORINI, Bernd Waidhas |
2025-08-19 |
| 12382712 |
Semiconductor dies and devices with frontside and backside coils for inductive coupling |
Peter Baumgartner, Joachim Assenmacher, Walther Lutz, Martin Ostermayr |
2025-08-05 |
| 12374625 |
Microelectronic assemblies having topside power delivery structures |
Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser |
2025-07-29 |
| 12347796 |
Semiconductor dies and devices with a coil for inductive coupling |
Martin Ostermayr, Walther Lutz, Joachim Assenmacher |
2025-07-01 |
| 12341096 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Thomas Wagner, Andreas Wolter, Bernd Waidhas |
2025-06-24 |
| 12249553 |
Thermal contacts at periphery of integrated circuit packages |
Sonja Koller, Vishnu Prasad |
2025-03-11 |
| 12243828 |
Microelectronic assemblies having topside power delivery structures |
Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser |
2025-03-04 |
| 12243856 |
Fan out packaging pop mechanical attach method |
David O'Sullivan, Richard Patten, Bernd Waidhas |
2025-03-04 |
| 12211796 |
Microelectronic assemblies having topside power delivery structures |
Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser |
2025-01-28 |
| 12191571 |
Antenna with graded dielectirc and method of making the same |
Saravana Maruthamuthu, Bernd Waidhas, Andreas Augustin |
2025-01-07 |