Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243856 | Fan out packaging pop mechanical attach method | David O'Sullivan, Georg Seidemann, Bernd Waidhas | 2025-03-04 |
| 12237305 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Pauli Jaervinen | 2025-02-25 |