PJ

Pauli Jaervinen

IN Intel: 1 patents #1,527 of 3,896Top 40%
Overall (2025): #258,627 of 469,880Top 60%
1
Patents 2025

Issued Patents 2025

Patent #TitleCo-InventorsDate
12237305 Integrated circuit package having wirebonded multi-die stack Thorsten Meyer, Richard Patten 2025-02-25