Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394726 | Method to implement wafer-level chip-scale packages with grounded conformal shield | Georg Seidemann, Bernd Waidhas | 2025-08-19 |
| 12308335 | Integrating and accessing passive components in wafer-level packages | Veronica Sciriha, Thomas Wagner | 2025-05-20 |