Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261084 | Fan-out wafer level packaging of semiconductor devices | Yusheng LIN, Gordon M. Grivna, Takashi Noma | 2025-03-25 |
| 12211920 | Backside ohmic contacts for semiconductor devices | Srinivasa Reddy Yeduru, Naveen Goud Ganagona, Byoungyong Park, Soonjae Lee | 2025-01-28 |