Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381093 | Hybrid patterning-bonding semiconductor tool | Anthony R. Schepis, David Conklin, Anton J. deVilliers | 2025-08-05 |
| 12381118 | 3D multiple location compressing bonded arm for advanced integration | Daniel Fulford, Anthony R. Schepis, Mark I. Gardner, H. Jim Fulford, Anton J. deVilliers +1 more | 2025-08-05 |
| 12374562 | Wafer shape control for W2W bonding | Anthony R. Schepis, David Conklin, Anton J. deVilliers | 2025-07-29 |
| 12204253 | In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones | Michael Murphy, Daniel Fulford, Steven Gueci, David Conklin | 2025-01-21 |