Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381118 | 3D multiple location compressing bonded arm for advanced integration | Andrew WELOTH, Daniel Fulford, Anthony R. Schepis, Mark I. Gardner, H. Jim Fulford +1 more | 2025-08-05 |
| 12381093 | Hybrid patterning-bonding semiconductor tool | Anthony R. Schepis, Andrew WELOTH, David Conklin | 2025-08-05 |
| 12374562 | Wafer shape control for W2W bonding | Anthony R. Schepis, Andrew WELOTH, David Conklin | 2025-07-29 |
| 12354991 | Replacement buried power rail in backside power delivery | Hoyoung Kang, Lars Liebmann, Jeffrey Smith, Daniel Chanemougame | 2025-07-08 |
| 12336274 | Self-aligned method for vertical recess for 3D device integration | Jeffrey Smith, Daniel Chanemougame, Lars Liebmann, Paul Gutwin, Subhadeep Kal +1 more | 2025-06-17 |
| 12327726 | Wet-dry bilayer resist dual tone exposure | — | 2025-06-10 |
| 12276922 | Backside deposition tuning of stress to control wafer bow in semiconductor processing | Daniel Fulford | 2025-04-15 |
| 12249508 | Selective patterning with wet-dry bilayer resist | — | 2025-03-11 |