Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394618 | Method of adjusting wafer shape using multi-directional actuation films | Charlotte Cutler, Michael Murphy | 2025-08-19 |
| 12381093 | Hybrid patterning-bonding semiconductor tool | Andrew WELOTH, David Conklin, Anton J. deVilliers | 2025-08-05 |
| 12381118 | 3D multiple location compressing bonded arm for advanced integration | Andrew WELOTH, Daniel Fulford, Mark I. Gardner, H. Jim Fulford, Anton J. deVilliers +1 more | 2025-08-05 |
| 12374562 | Wafer shape control for W2W bonding | Andrew WELOTH, David Conklin, Anton J. deVilliers | 2025-07-29 |