Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381118 | 3D multiple location compressing bonded arm for advanced integration | Andrew WELOTH, Anthony R. Schepis, Mark I. Gardner, H. Jim Fulford, Anton J. deVilliers +1 more | 2025-08-05 |
| 12341053 | System for backside deposition of a substrate | Ronald Nasman, Gerrit J. Leusink, Rodney L. Robison, Hoyoung Kang | 2025-06-24 |
| 12276922 | Backside deposition tuning of stress to control wafer bow in semiconductor processing | Anton J. deVilliers | 2025-04-15 |
| 12204253 | In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones | Andrew WELOTH, Michael Murphy, Steven Gueci, David Conklin | 2025-01-21 |