Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412797 | Hybrid embedded package | Chee Yang Ng | 2025-09-09 |
| 12283538 | Molded semiconductor package having an embedded inlay | Marcus Boehm, Michael Fuegl, Ludwig Heitzer | 2025-04-22 |