MB

Marcus Boehm

Infineon Technologies Ag: 1 patents #187 of 674Top 30%
📍 Thalmässing, NJ: #1 of 1 inventorsTop 100%
Overall (2025): #299,175 of 469,880Top 65%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12283538 Molded semiconductor package having an embedded inlay Michael Fuegl, Ludwig Heitzer, Stefan Woetzel 2025-04-22