Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283538 | Molded semiconductor package having an embedded inlay | Marcus Boehm, Ludwig Heitzer, Stefan Woetzel | 2025-04-22 |
MF
Michael Fuegl
Overall (2025): #280,976 of 469,880Top 60%
1
Patents 2025