Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412797 | Hybrid embedded package | Stefan Woetzel | 2025-09-09 |
| 12232302 | Dipped coated electronic module assembly with enhanced thermal distribution | Swee Kah Lee | 2025-02-18 |
CN
Chee Yang Ng
Infineon Technologies Austria Ag: 1 patents #49 of 201Top 25%
Overall (2025): #134,709 of 469,880Top 30%
2
Patents 2025