Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12232302 | Dipped coated electronic module assembly with enhanced thermal distribution | Chee Yang Ng | 2025-02-18 |
| 12218038 | Leadframe, semiconductor package and method | Chau Fatt Chiang, Paul Armand Asentista Calo, Kok Yau Chua, Josef Hoeglauer, Khay Chwan Saw | 2025-02-04 |