Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300559 | Semiconductor packages and methods for manufacturing thereof | Si Hao Vincent Yeo, Chan Lam Cha, Ying Dieh Cheong, Cher Hau Danny Koh, Wern Ken Daryl Wee +7 more | 2025-05-13 |
| 12218038 | Leadframe, semiconductor package and method | Paul Armand Asentista Calo, Kok Yau Chua, Josef Hoeglauer, Swee Kah Lee, Khay Chwan Saw | 2025-02-04 |