Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300559 | Semiconductor packages and methods for manufacturing thereof | Si Hao Vincent Yeo, Ying Dieh Cheong, Chau Fatt Chiang, Cher Hau Danny Koh, Wern Ken Daryl Wee +7 more | 2025-05-13 |
| 12278171 | Chip package and method of forming a chip package | Wern Ken Daryl Wee, Hoe Jian Chong, Chin Kee Leow | 2025-04-15 |