Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278171 | Chip package and method of forming a chip package | Chan Lam Cha, Wern Ken Daryl Wee, Hoe Jian Chong | 2025-04-15 |
CL
Chin Kee Leow
Overall (2025): #425,536 of 469,880Top 95%
1
Patents 2025