WH

Wen-Hung Huang

TSMC: 5 patents #599 of 3,957Top 20%
AE Advanced Semiconductor Engineering: 4 patents #3 of 125Top 3%
NB Nxp B.V.: 3 patents #15 of 348Top 5%
CC Chengdu Boe Optoelectronics Technology Co.: 1 patents #354 of 685Top 55%
NT Nuvoton Technology: 1 patents #10 of 57Top 20%
BO BOE: 1 patents #1,623 of 3,061Top 55%
Overall (2025): #2,912 of 469,880Top 1%
14
Patents 2025

Issued Patents 2025

Patent #TitleCo-InventorsDate
12431872 Semiconductor circuit and method for operating the same Chin-Hua Wen 2025-09-30
12418997 Display device Jingchang SU, Xin Bi, Jianjun Wu, Xianfeng Yang, Jiahua Wang +3 more 2025-09-16
12406951 Redistribution layer having a sideview zig-zag profile Kuan-Hsiang Mao, Yufu Liu, Tsung Nan Lo 2025-09-02
12339970 Secure boot device, method and electronic system using the same 2025-06-24
12324216 Metal gates for multi-gate devices and fabrication methods thereof Jo-Chun Hung, Chih-Wei Lee, Kuo-Feng Yu 2025-06-03
12315820 Wiring structure including low- and high-density conductive structures 2025-05-27
12317574 Device providing multiple threshold voltages and methods of making the same Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Mei-Yun Wang 2025-05-27
12315797 Semiconductor substrate structure and method of manufacturing the same 2025-05-27
12300677 Semiconductor device package including stress buffering layer Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Yuh-Shan Su, Chih-Cheng Lee +1 more 2025-05-13
12302627 Semiconductor device with non-conformal gate dielectric layers Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Kuei-Lun Lin 2025-05-13
12288770 Semiconductor packages with embedded wiring on re-distributed bumps Kuan-Hsiang Mao, Norazham Mohd Sukemi, Chin Teck Siong, Tsung Nan Lo 2025-04-29
12266575 Multiple gate field-effect transistors having various gate oxide thicknesses and methods of forming the same Chih-Wei Lee, Kuo-Feng Yu, Jian-Hao Chen, Hsueh-Ju Chen, Zoe Chen 2025-04-01
12249585 Semiconductor device package 2025-03-11
12198998 Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process Kuan-Hsiang Mao, Che Ming Fang, Yufu Liu 2025-01-14