Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300677 | Semiconductor device package including stress buffering layer | Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su, Chih-Cheng Lee +1 more | 2025-05-13 |
| 12218075 | Package structure | Cheng-Yuan KUNG, Hsu-Chiang Shih, Hung-Yi Lin | 2025-02-04 |