Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374631 | Semiconductor device package and method of manufacturing the same | Hung-Yi Lin, Meng-Wei Hsieh, Yu-Sheng Chang, Hsiu-Chi Liu, Mark A. Gerber | 2025-07-29 |
| 12218075 | Package structure | Cheng-Yuan KUNG, Hung-Yi Lin, Chien-Mei Huang | 2025-02-04 |