Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406951 | Redistribution layer having a sideview zig-zag profile | Kuan-Hsiang Mao, Yufu Liu, Wen-Hung Huang | 2025-09-02 |
| 12288770 | Semiconductor packages with embedded wiring on re-distributed bumps | Kuan-Hsiang Mao, Norazham Mohd Sukemi, Chin Teck Siong, Wen-Hung Huang | 2025-04-29 |