Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198998 | Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process | Kuan-Hsiang Mao, Yufu Liu, Wen-Hung Huang | 2025-01-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198998 | Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process | Kuan-Hsiang Mao, Yufu Liu, Wen-Hung Huang | 2025-01-14 |