YC

Yu-Jen Cheng

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 New Taipei, TW: #607 of 1,741 inventorsTop 35%
Overall (2024): #203,664 of 561,600Top 40%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11990443 Semiconductor die package and method of manufacture Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Shu-Chia Hsu, Yu-Yun Huang +1 more 2024-05-21