Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12099792 | Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects | Hsien Yu Tseng, Amit Kundu, Chun-Wei Chang, Szu-Lin Liu | 2024-09-24 |
| 12046638 | Fin field effect transistor (FinFET) device having position-dependent heat generation | Jhong-Sheng Wang, Jiaw-Ren Shih, Chun-Wei Chang | 2024-07-23 |
| 12027391 | Electromigration evaluation methodology with consideration of thermal and signal effects | Hsien Yu Tseng | 2024-07-02 |
| 11901289 | Semiconductor device structure with resistive element | Wan-Te Chen, Chung-Hui Chen, Wei-Chih Chen, Chii-Ping Chen, Wen-Sheh Huang +1 more | 2024-02-13 |