HT

Hsien Yu Tseng

TSMC: 3 patents #1,177 of 4,162Top 30%
Overall (2024): #84,235 of 561,600Top 15%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12099792 Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects Amit Kundu, Chun-Wei Chang, Szu-Lin Liu, Sheng-Feng Liu 2024-09-24
12086525 Electrically aware routing for integrated circuits Guan-Ruei Lu, Wei-Ming Chen, Chih.Chi. Hsiao 2024-09-10
12027391 Electromigration evaluation methodology with consideration of thermal and signal effects Sheng-Feng Liu 2024-07-02