CC

Chun-Wei Chang

TSMC: 8 patents #414 of 4,162Top 10%
PI P-Two Industries: 2 patents #1 of 5Top 20%
EP Epistar: 1 patents #48 of 137Top 40%
📍 Taoyuan, AZ: #1 of 2 inventorsTop 50%
Overall (2024): #6,932 of 561,600Top 2%
12
Patents 2024

Issued Patents 2024

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
12131992 Semiconductor structure and method of manufacturing the same Hsuan-Ming Huang, Jian-Hong Lin, Ming-Hong Hsieh, Mingni Chang, Ming-Yih Wang 2024-10-29
12128527 Vise quick-change base with improved structure 2024-10-29
12125956 Semiconductor device and semiconductor component including the same Yu-Tsu LEE, Yi-Yang Chiu, Min-Hao YANG, Wei-Jen Hsueh, Yi-Ming Chen +2 more 2024-10-22
12099792 Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects Hsien Yu Tseng, Amit Kundu, Szu-Lin Liu, Sheng-Feng Liu 2024-09-24
12100592 Implantation mask formation Wei-Chao Chiu, Yong-Jin LIOU, Yu-Wen Chen, Ching-Sen Kuo, Feng-Jia Shiu 2024-09-24
12088043 Easy lock connector with unlock structure Hsien-Chang Lin 2024-09-10
12046638 Fin field effect transistor (FinFET) device having position-dependent heat generation Jhong-Sheng Wang, Jiaw-Ren Shih, Sheng-Feng Liu 2024-07-23
12040336 Semiconductor imaging device having improved dark current performance Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Feng-Chi Hung, Feng-Jia Shiu +5 more 2024-07-16
11996432 Image sensor device and manufacturing method thereof Wei-Chao Chiu, Ching-Sen Kuo, Feng-Jia Shiu 2024-05-28
11978511 Phase-change memory cell and method for fabricating the same Yung-Huei Lee, Jian-Hong Lin, Wen-Hsien Kuo, Pei-Chun Liao, Chih-Hung Nien 2024-05-07
11955741 Buckle connector Shien-Chang Lin 2024-04-09
11924965 Package component and forming method thereof Jian-Hong Lin, Shu-Yuan Ku, Wei-Cheng Liu, Yinlung Lu, Jun He 2024-03-05