Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12162749 | Bond wave optimization method and device | Kang-Yi Lien, I-Hsuan Chiu, Yi Huang, Chia-Ming Hung, Kuan-Chi Tsai | 2024-12-10 |
| 12015001 | Bonding structure and method thereof | Wen-Chuan Tai, Fan Hu, Li Peng | 2024-06-18 |